High-Speed Interconnects for AI & Physical AI with Samtec

In this episode of OnTrack: The PCB Design Podcast, host Zach Peterson welcomes Matt Burns, Director of Technical Marketing at Samtec, to discuss the evolving role of high-speed interconnects in modern electronics, particularly in the context of AI and physical AI. The conversation explores how interconnects have shifted from being an afterthought in PCB design to a critical, early-stage architectural consideration—especially in data centers and AI systems. Matt highlights Samtec’s advanced connector solutions like SciFly LP, Accelerate HP, and SciFly HD, which enable near-chip and co-packaged interconnects for 112G, 224G, and emerging 448G data rates. These innovations support signal integrity, reduce loss by 5–6 dB through co-packaged designs, and allow seamless transitions between copper and optical connectivity. The discussion also extends to embedded systems, where Samtec is adapting data center advancements—like smaller, denser connectors and optimized signal breakout—to enable higher performance in ComHPC and other open standards, even as embedded applications lag behind by 2–3 generations. Finally, Matt envisions physical AI as a convergence of AI, robotics, and embedded computing, driving demand for compact, flexible, and high-density interconnect solutions that can fit into unconventional form factors, especially in humanoid robotics. Key takeaways include: 1) Interconnects must be designed early in the system architecture, not as an afterthought; 2) Co-packaged copper and optics offer significant signal integrity improvements (5–6 dB loss reduction) over near-chip solutions; 3) Embedded systems are adopting data center interconnect innovations at a slower pace but are rapidly catching up; 4) The rise of physical AI and robotics demands smaller, more flexible interconnects; 5) Samtec’s focus on smaller pitches (down to 0.5mm), open standards, and multi-source compatibility enables scalability across AI, networking, and embedded applications. The overall tone is forward-looking, optimistic, and deeply technical, emphasizing innovation, adaptability, and the critical role of interconnects in enabling next-gen electronics.